Subject:                              Time:  4:28 PM
  OFFICE MEMO         ASSY: TSOP Underfilling?              Date:  7/16/96

We have been using TSOP (Thin Small Outline Packages), both type I and II configurations, reliably for several years on relatively thick boards (63-110 mils thick) without any underfill.  I've heard of problems with the solder joints of these devices when they're used on thin boards - we have a board that looks like it will be about 31 mils thick.   Some people have described the need for an epoxy underfill to dampen the stresses at the solder joints.  Can anybody comment on this?

Thanks for any assistance!

Greg Bartlett
Mercury Computer Systems
Chelmsford, MA
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